Study of adhesive bonds by mechanical tests, ultrasounds and electromechanical impedance method,Structural Health Monitoring 2017: Real-Time Material State Awareness and Data-Driven Safety Assurance - Proceedings of the 11th International Workshop on Structural Health Monitoring (IWSHM 2017), Stanford, California, USA, September 12-14 2017

Τίτλος

Study of adhesive bonds by mechanical tests, ultrasounds and electromechanical impedance method,Structural Health Monitoring 2017: Real-Time Material State Awareness and Data-Driven Safety Assurance - Proceedings of the 11th International Workshop on Structural Health Monitoring (IWSHM 2017), Stanford, California, USA, September 12-14 2017

Συγγραφείς

Malinowski P.H., Tserpes K.I., Ecault R., Ostachowicz W.M.

Συσχέτιση με προσωπικό

Tserpes Konstantinos